A long-standing collaboration was officially cemented with the signing of a Memorandum of Understanding (MoU) with Universiti Malaysia Perlis (UniMAP)! This undoubtedly marks the beginning of a more structured and intensified partnership between both parties – with a shared vision of strengthening the semiconductor ecosystem through the development of highly-skilled engineers.
This collaboration goes above and beyond as it mirrors the shared commitment to bridging academia and industry, accelerating talent development and advancing technological capabilities to remain competitive on a global stage.
Commending UniMAP’s proactive efforts in extending collaboration beyond the academic sphere, we are truly honoured to contribute to this initiative. Excited of what’s in store for us ahead, we look forward to driving impactful programmes and innovations together in shaping a more positive outlook for the semiconductor industry!
